Fitlet 3

Fitlet3 specifications

CPU

• Intel Atom x6425E 4 Core | Base: 2.0 GHz, Boost: 3.0 GHz | TDP: 12 W
• Intel Celeron J6413 4 Core | Base: 1.8 GHz, Boost: 3.0 GHz | TDP: 10 W
• Intel Atom x6211E 2 Core | Base: 1.3 GHz, Boost: 3.0 GHz | TDP: 6 W

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RAM

• Up to 32 GB  1x SO-DIMM DDR4 Non-ECC DDR4-3200MT/S (1.2V)

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Storage

• M.2 Key-M 2242 | 2260  | 2280  NVMe or SATA M.2
• M.2 Key-B 2242 | 2260  SATA M.2
• 2.5″ SATA HDD/SSD Expansion  Optional 2.5″ storage using SATA expansion (in development)

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Display

• mini DP 1.2  DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode
• HDMI 1.4b  HDMI 1.4b (up to 3840 x 2160 @ 30Hz)

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Networking

• LAN 2x Gigabit on-board Ethernet ports on RJ45 (1000 Mbps / 100 Mbps / 10 Mbps)
• ‍On-board Wireless LAN Optional On-board module with Wi-Fi 6E, BT 5.2
• M.2 Key-E For M.2 2230 module with Wi-Fi 6E, BT 5.2
• M.2 Key-B for Cellular communication Optional M.2, LTE/5G modem, with micro-SIM tray
• Up to 4x Gbit Ethernet 1. Additional 2x GbE LAN on RJ45 on FC3-LAN FACET Card (Optional) 2. Additional 1x GbE LAN on SFP+ for optical LAN on FC3-OPLN FACET Card (Optional) 3. Additional 1x GbE LAN on RJ45 with PoE device capabilities on FC3-POED FACET Card (Optional)

I/O

• USB  4x USB 2.0 on USB Type-A
• 6 on-board ports  2x USB 3.1 on USB Type-A
• Audio  Optional analog output, analog input on 3.5 mm jacksAudio on display output via HDMI and DP
• Serial/GPIO  Optional isolated serial port (RS-232/422/485) and GPIO, up to 24V, on terminal block2x isolated GPI + 2x isolated GPO

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Extensions

Available FACET cards:

• FC3-LAN – 2x GbE LAN on RJ45
• FC3-POED – GbE LAN PoE device on RJ45
• FC3-OPLN – GbE on SFP+ for optic LAN
• EB-M2SATA – SATA expansion for 2.5” HDD / SSD

BIOS/OS

• BIOS:  AMI Aptio V  Compatible with other Windows 10 /11 variants.
• Operating systems:  Compatible with other Linux variants.
• Windows 10 IoT Enterprise LTSC 2021
• Windows 10 Pro  Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD)
• Windows 11 Pro
• Linux Mint/ Ubuntu
• Info FACET Card interface includes 2x PCIe, USB an.Additional FACET cards are under development.FACET expansion card and Wi-Fi/BT card are mutually exclusive. For Wi-Fi/BT on systems with FACET cards, an onboard Wi-Fi/BT module must be selected.

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Operating conditions

Power

Input voltage range DC 7V – 42V / Power consumption 5W – 25W

• CPU type
• System load
• Installed devices
• Connected peripherals
• Info fitlet3 is low power Class III (EN/IEC 62368-1 Audio/video, information and communication technology) equipment that is to be powered from external DC Low Power  (LPS) unregulated power supply. The external power supply ratings and unregulated voltage boundaries should comply with ones defined in specifications of the specific model. Nominal current rating (A) should be increased if external peripheral devices are to be powered by fitlet3. Compulab delivers fitlet3 with a general purpose 12V 3A  AC-DC power adapter that isn’t an integral part of fitlet3 and may be ordered separately as an accessory. In case fitlet3 is powered from another power supply, user should ensure that power supply complies with fitlet3 power requirements. The power connector should meet the following requirements: a. 5.5 x 2.5mm standard barrel, b. Inner contact – fork type, c.“+” inner contact, “-” outer contact.

Temperature & humidity

• Operating temperature range Up to -40°C to 85°C*
• Relative humidity 5% – 95% non-condensing‍
• Info When ordered in industrial temperature range. Commercial and extended temperature range are also available. The power supply that ships with fitlet3 is not rated for extended temperatures. Buyer is advised to deploy fitlet3 in extended temperature with a suitable power supply.

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Shock and vibration

MIL STD 810G compliant  

• Vibration test: IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-64 (up to 2 KHz , 3 axis)
• Shock test: IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-27 (15g , 6 directions)

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Mechanical specifications

Dimensions& weight‍

• Standard housing 132.8 mm X 100 mm X 34.8 mm‍
• Weight 420 gram

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Housing & cooling

All metal housing

• Aluminium | zinc die cast parts
• Fanless convection cooling through the housing  No vents

Mounting

• VESA / wall mounting bracket*
• DIN-rail mounting bracket*

Additional features & services

Functional features

• Auto-on
• Programmable indicator LEDs
• Removable RTC battery
• Auxiliary power header
• RTC reset tactile switch
• Trusted Platform Module (TPM)
• Remote power button

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Firmware & BIOS features

• PXE boot
• Wake-on-LAN
• Wake-on-timer

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Mechanical features

• Kensington lock
• Power plug twist lock
• Mechanical disabling of power button

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Services

• OEM rebranding incl. logo and BIOS splash-screen
• Build-to-order
• Software imaging
• Burn-in testing