Tensor I22

Tensor-I22 specifications

CPU

• Intel® Core i7-1185G7E 4 Core, 8 Threads | Base: 1.8/2.8 GHz, Boost: 4.4 GHz | 12 MB Cache | TDP: 15/28 W1 | vPro
• Intel® Core i5-1145G7E 4 Core, 8 Threads | Base: 1.5/2.6 GHz, Boost: 4.1 GHz | 8 MB Cache | TDP: 15/28 W | vPro
• Intel® Celeron 6305E 2 Cores, 2 Threads | Base: 1.8 GHz | 4 MB Cache | TDP 15 W
• Info CPU frequency is preset to match cooling capacity and target case temperature.Owner can adjust this setting in BIOS.For 28W CPU operation, EW30-ECR20 housing is recommended (300 X 200 X 45.3 mm)
  

RAM

• Up to 64 GB 2x SODIMM DDR4 up to 3200MT/S

Storage

• Storage devices: Up to 3 NVMe/ SATA storage devices
• Basic configuration: NVMe or SATA on M.2 (PCIe x4 Gen. 4 or SATA 3)
• Optional TEL-NVME on TRIP1 Additional NVMe on M.2 (PCIe x4 Gen. 3)
• Optional TEL-NVME on TRIP2 Additional SATA on M.2
• Optional TEL-SATA1 1 Additional SATA on 2.5” for SSD/HDD
• Info Some expansion TELs require a larger housing

Display

• Graphics: Integrated Intel® Iris® Xe Graphics
• Display outputs: Up to four independent displays
• HDMI 2x HDMI 1.4b (up to 3840 x 2160 @ 30Hz)
• Mini-Display Port 2x DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode

Networking

• Ethernet ports Up to 4 ports
• Basic configuration 2x Gigabit Ethernet on RJ45
• Optional TEL-LANX2 Additional 2x Gigabit Ethernet on RJ45
• Optional TEL-OPLNX2 Additional 2x SFP+ ports for optical LAN
• Optional TEL-POEX2 Additional 2x GbE LAN on RJ45 with PoE source of up to 15W each
• Info Some expansion TELs require a larger housing

Wireless Connectivity

• M.2 Key-E 1 For M.2 2230 module with Wi-Fi 6E, BT 5.2
• M.2 Key-B 1 For M.2 LTE/5G
• Optional TEL-PCIEmini For mini PCIe module, w/ micro-SIM tray
• Info Additional options are available with extension TELs

I/O

• USB ports Up to 12 USB 3.1 / 2.0 ports
• Basic configuration 4x USB Type-A: 2x USB 3.1 + 2x USB 2.0
• Optional TEL-USB3PCIV4 Up to 2 additional 4x USB 3.1 on USB Type-A
• Optional TEL- USB2V4 Up to 2 additional 4x USB 2.0 on USB Type-A

Audio

• Codec Optional analog audio on TEL-AUDIO
• Interfaces Optional analog output, analog input on 3.5 mm jacks

Serial/GPIO

• Serial/GPIO ports 1 Up to 20 RS-232 / RS-485 or 40+ isolated GPIOs
• RS-232 / RS-485 1 Up to 20 RS-232 / RS-485 ports on DB9
• CAN bus Up to 5 isolated CAN bus ports on DB9
• GPIO Up to 5 modules with 20 isolated GPIOs each, on terminal blocks
• Info Some expansion TELs require a larger housing

OS support

• Windows 10 Windows 10 IoT Enterprise LTSC 2021 / Windows 10 Pro
• Windows 11 Windows 11 Pro
• Linux Linux Mint / Ubuntu

Operating conditions

Power

• Input power Modular power
• Standard power input 12V, 5.5 mm power jack w/ locking, 60W universal PSU
• Wide voltage power input 12-56V, 6-pin ATX power connector w/ locking, 120W universal PSU

Temperature & humidity

• Commercial temperature 0°C to 45°C
• Extended temperature -20°C to 70°C
• Industrial temperature -40°C to 70°C
• Humidity 5% – 95% non-condensing

Mechanical specifications

Dimensions & weight

• Standard housing 200 mm X 200 mm X 35.3 mm
• Weight 420 gram
  

Housing & cooling

• All metal housing Aluminium | zinc die cast parts
• Fanless convection cooling through the housing No vents

Mounting

• Side/bottom VESA / DIN Rail mount Sold separately
  

Additional features & services

Functional features

• Auto-on
• Removable RTC battery
• Auxiliary power header
• RTC reset tactile switch
• Trusted Platform Module (TPM)
• Remote power button

Firmware & BIOS features

• PXE boot
• Wake-on-LAN
• Wake-on-timer

Services

• OEM rebranding incl. logo and BIOS splash-screen
• Software imaging
• Burn-in testing