BedRock RAI300

CPU

• AMD Ryzen™ AI 9 HX 370
• 12C / 24T Zen 5 (4nm)
• Up to 5.1 GHz
• Up to 54W

GPU

• AMD Radeon™ 890M
• 16 CU @ 2900 MHz

NPU

• AMD Ryzen™ AI
• 50 TOPS

AI Acceleration

• Up to 2× Hailo-8 M.2 AI Inferencing Acceleration Module (26 TOPS each)
• Up to 2× Hailo-10 M.2 Generative AI Acceleration Module (40 TOPS each)
• 2× M.2 Key-M 2242 (each precludes one NVMe)

RAM

• 128-bit DDR5 5600
• Up to 128 GB
• 2× SODIMM (2×32-bit each)
• Conduction cooled

TPM

• fTPM 2.0 (integrated in Ryzen)
• dTPM 2.0 (Infineon)
• Selectable in BIOS

Display

• Up to 4 display outputs
• HDMI 2.1
• DisplayPort 2.1
• Max resolution 7680×4320 @ 60 Hz
• Max resolution 3840×2160 @ 240 Hz

Storage

• Up to 3× NVMe PCIe Gen4 x4
• M.2 Key-M 2280
• Optional power-loss protection
• Conduction cooled
• Each 2nd/3rd NVMe precludes one Hailo-8 Key-M

LAN

• Up to 4× 2.5 GbE (Intel I226)
• 4× RJ45 (NIO R8000 4X25)
• 2× RJ45 (NIO R7000 Basic)

Modem

• 4G / 5G (Quectel)
• Up to 4× SMA antennas
• Optional and upgradable
• M.2 Key-B 3042 / 3052

USB

• 1× USB 4.0 (40 Gb/s)
• 1× USB 3.2 Gen 2 (10 Gb/s)
• 3× USB 3.2 Gen 2 (5 Gb/s)
• USB-C / USB-A connectors

Console

• Serial over USB
• Mini-USB connector

BIOS

• AMI Aptio V
• Dual SPI Flash for redundancy
• Console redirection

Operating Systems

• Windows 11 / Windows IoT
• Linux
• Other x86 operating systems supported

Power

• 12V–60V DC input
• Phoenix terminal
• Other DC connectors available

Temperature Range

• -40°C to 85°C
• Commercial temperature range also available

Enclosure

• All-aluminum enclosure
• Fanless cooling

Dimensions

• 60W model: 73 mm (W) × 160 mm (H) × 130 mm (D)
• Tile model: 29 mm (W) × 160 mm (H) × 130 mm (D)

Mounting

• DIN-rail
• Wall
• VESA
• Table top

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