About
Power & Efficiency in Perfect Balance
Bedrock R8000 is powered by the state-of-the-art AMD Ryzen Embedded 8000 processor with 8 Zen 4 cores and 16 threads running at up to 5.1 GHz.It is the most power efficient high-performance x86 CPU on the market for compute and graphics workloads.
Advantages
Key Features
Fanless & Silent Operation
Rugged & Reliable Construction
Versatile Connectivity Options
Expandable Storage Capacity
Multiple Display Support
Low Power Consumption
Advanced Security Features
Easy Customization Options
BedRock R8000 specifications
CPU
- AMD Ryzen™ Embedded 8000 Series
- 8C/16T Zen4 4nm
- Up to 5.2 GHz
- Up to 54W
GPU
- AMD Radeon™ 780M
- Up to 12 CU @ 2700 MHz
AI Acceleration
- Up to 3x Hailo-8 M.2 AI Inferencing Acceleration Module 26 TOPS
- Up to 2x Hailo-10 M.2 Generative AI Acceleration Module 40 TOPS
RAM
- Dual channel DDR5-5600 up to 96 GB ECC / non-ECC
- 2x SODIMM (2×32 bit each)RAM is conduction cooled
Display
- 1x HDMI 2.1
- 1x Display Port 2.1
- 2x mini-DisplayPort 2.1
- Max resolution / refresh rate:7680×4320 @ 60Hz3840×2160 @ 240H
Main storage
- NVMe PCIe Gen4 x 4
- M.2 key-M 2280Optional power-loss-protection NVMe is conduction cooled
Extra storage
- 2x NVMe PCIe Gen4 x 4
- 2x M.2 key-M 2280NVMe devices are conduction cooled
LAN
- 2x 2.5 GbE (Intel I226)
- 2x RJ45
WLAN
- WiFi 6E (Intel AX210)BT 5.3
- 2x RP-SMA antennasOptional and upgradable (M.2 key-E 2230)
Modem
- 4G / 5G (Quectel)
- 2x SMA antennasOptional and upgradable (M.2 key-B 3042 / 3052)
USB
- 1x USB 3.2 gen 2 10 Gb/s
- 3x USB 3.2 gen 2 5 Gb/s
- Connectors:4x USB type-A
Console
- Serial over USB
- mini-USB connector
BIOS
- AMI Aptio V
- Dual SPI FLASH for redundancy Console redirection
Operating systems
- Windows 10/11/IoT, Linux
- Other x86 operating systems supported
Operating conditions
Power
- DC 12V-60V
- Phoenix terminal Other DC connectors available
Temperature range
- Up to -40ºC to 85ºC
- Also available in commercial temperature range
Mechanical specifications
Dimensions
- 30W model: 45 mm (W) x 160 mm (H) x 130 mm (D) – 0.9 liter
- 60W model: 73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter
- Tile model: 29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter
Mounting
- DIN-rail, wall, table top
BedRock R8000 specifications
CPU
- AMD Ryzen™ Embedded 8000 Series
- 8C/16T Zen4 4nm
- Up to 5.2 GHz
- Up to 54W
GPU
- AMD Radeon™ 780M
- Up to 12 CU @ 2700 MHz
AI Acceleration
- Up to 3x Hailo-8 M.2 AI Inferencing Acceleration Module 26 TOPS
- Up to 2x Hailo-10 M.2 Generative AI Acceleration Module 40 TOPS
RAM
- Dual channel DDR5-5600 up to 96 GB ECC / non-ECC
- 2x SODIMM (2×32 bit each)RAM is conduction cooled
Display
- 1x HDMI 2.1
- 1x Display Port 2.1
- 2x mini-DisplayPort 2.1
- Max resolution / refresh rate:7680×4320 @ 60Hz3840×2160 @ 240H
Main storage
- NVMe PCIe Gen4 x 4
- M.2 key-M 2280Optional power-loss-protection NVMe is conduction cooled
Extra storage
- 2x NVMe PCIe Gen4 x 4
- 2x M.2 key-M 2280NVMe devices are conduction cooled
LAN
- 2x 2.5 GbE (Intel I226)
- 2x RJ45
WLAN
- WiFi 6E (Intel AX210)BT 5.3
- 2x RP-SMA antennasOptional and upgradable (M.2 key-E 2230)
Modem
- 4G / 5G (Quectel)
- 2x SMA antennasOptional and upgradable (M.2 key-B 3042 / 3052)
USB
- 1x USB 3.2 gen 2 10 Gb/s
- 3x USB 3.2 gen 2 5 Gb/s
- Connectors:4x USB type-A
Console
- Serial over USB
- mini-USB connector
BIOS
- AMI Aptio V
- Dual SPI FLASH for redundancy Console redirection
Operating systems
- Windows 10/11/IoT, Linux
- Other x86 operating systems supported
Operating conditions
Power
- DC 12V-60V
- Phoenix terminal Other DC connectors available
Temperature range
- Up to -40ºC to 85ºC
- Also available in commercial temperature range
Mechanical specifications
Dimensions
- 30W model: 45 mm (W) x 160 mm (H) x 130 mm (D) – 0.9 liter
- 60W model: 73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter
- Tile model: 29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter
Mounting
- DIN-rail, wall, table top
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