General Notes

• "Option" column specifies the configuration code required to have the particular feature.
• "+" means that the feature is always available.

CPU, Memory and Storage

• CPU: NXP i.MX8M Plus QuadLite, quad-core ARM Cortex-A53, 1.8GHz
• C1800Q: NXP i.MX8M Plus Quad, quad-core ARM Cortex-A53, 1.8GHz
• C1800QM (NPU): AI/ML Neural Processing Unit, up to 2.3 TOPS
• Real-Time Co-processor: ARM Cortex-M7, 800MHz
• RAM: 1GB – 8GB, LPDDR4
• Storage (N): 16GB – 128GB eMMC flash, soldered on-board

Network

• LAN: 2x Gbit Ethernet, RJ45 connectors
• WiFi and Bluetooth (WB): 802.11ac WiFi and Bluetooth 5.3 BLE, implemented with NXP 88W8997 module, 1x RP-SMA antenna connector
• Cellular Modem (JEG25G): 4G/LTE CAT4, Quectel EG25G, worldwide LTE, UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• Cellular Modem (JEG21G): LTE CAT1, Quectel EG21G, worldwide LTE, UMTS/HSPA+ and GSM/GPRS/EDGE coverage
• SIM Card Socket: Included
• GNSS: GPS, implemented with Quectel EG25 module (mutually exclusive with WB option)
• GNSS Options: JEG25G or JEG21G, NOT WB

I/O

• USB: 1x USB3.0 port, type-A connector
• Serial Ports:
  • 1x RS485, 2-wire half-duplex, isolated, terminal-block connector
  • 1x RS232, Rx/Tx, isolated, terminal-block connector
• CAN bus: 1x CAN bus port, isolated, terminal-block connector
• Digital I/O: 2x digital outputs + 2x digital inputs, isolated, 24V compliant with EN 61131-2, terminal-block connector
• Debug:
  • 1x serial console via UART-to-USB bridge, micro-USB connector
  • NXP SDP programming port, micro-USB connector

I/O Expansion Modules

• WiFi and Bluetooth (FAWB): 802.11ax WiFi and Bluetooth 5.3 BLE, implemented with Intel WiFi 6E AX210, 2x RP-SMA connectors
  • Stacking restriction: one IFM-WB module
• Wireless Mesh (FxMESH): Bluetooth mesh, Thread, Zigbee, Nordic nRF52840 / Silicon Labs MGM240, 1x RP-SMA connector
  • Stacking restriction: 3 RS485 | RS232 | MESH modules
• RS485 (FxRS4): 4x RS485, two-wire, isolated, terminal-block connector
  • Stacking restriction: 3 RS485 | RS232 | MESH modules
• RS232 (FxRS2): 4x RS232, Rx/Tx, isolated, terminal-block connector
  • Stacking restriction: 3 RS485 | RS232 | MESH modules
• Digital I/O (FxDI8O8): 8x digital outputs + 8x digital inputs, isolated, 24V compliant with EN 61131-2, terminal-block connector
  • Stacking restriction: up to 4 digital I/O modules
• CAN bus (FxCAN):
  • 2x CAN-FD, isolated, terminal-block connector
  • 4x digital outputs + 4x digital inputs, isolated, 24V compliant with EN 61131-2
  • Stacking restriction: 1 CAN bus module
• ADC (FxADC8): 8x analog inputs, 0...10V / 4…20mA, isolated, terminal block connector
  • Stacking restriction: one ADC module
• Secondary Storage (FANVME): NVME SSD storage

System

• RTC: Real time clock operated from on-board coin-cell battery
• Watchdog: Hardware watchdog
• Security: Secure boot, implemented with i.MX8M Plus HAB module
• TPM: TPM 2.0, Infineon SLB9673
• Indicators: 2x programmable dual-color LEDs

Electrical Specifications

• Power Supply: 12V – 24V DC (-20% / +20%), reverse voltage protection
• Power Consumption: 2.5W – 8W, depending on system load and configuration

Mechanical Specifications

• Housing Type: DIN rail housing (for DIN rail version EN 50022)
• Housing Material: ABS/PC high endurance
• Cooling: Passive cooling, fanless design
• Dimensions (H x W x D):
  • Gateway: 110 x 30 x 95 mm
  • I/O modules: 110 x 20 x 95 mm
• Weight:
  • Gateway: 220 grams
  • I/O modules: 110 grams

Compliance

• Regulatory: FCC, CE, UKCA
• EMC: EN 55032/5, EN 61000-6-2, EN 61000-6-3
• Safety: EN/UL/IEC 62368-1

Reliability and Environmental

• MTTF: > 200,000 hours
• Warranty: 5 years
• Operation Temperature: Commercial: 0° to 50° C / Industrial: -30° to 70° C
• Storage Temperature: -40° to 85° C
• Relative Humidity: 10% to 90% (non-condensing)

‍

‍

Expansion Modules Overview

IFM-DI8O8 – 8x DIN + 8x DOUT

• Interface:
  • 8x digital inputs, compliant with EN 61131-2
  • 8x digital outputs, compliant with EN 61131-2
  • Galvanically isolated from main system
• Product Name: IOT-DIN-IMX8PLUS IFM-DI8O8 I/O module
• Connectors: 2x 10-pin socket with push-in spring contacts
• Power Supply: 12 – 24 VDC from external source, 4-pin socket with screw-type terminal
• Stacking Restrictions: Up to 4x IFM-DI8O8 modules

IFM-RS485 – 4x RS485 Ports

• Interface:
  • 4x RS485 ports, 2-wire
  • Programmable baud rate up to 4Mbps
  • Galvanically isolated from main unit
• Product Name: IOT-DIN-IMX8PLUS IFM-RS485 I/O module
• Connectors: 2x 10-pin socket with push-in spring contacts
• Stacking Restrictions: Up to 3x IFM-RS485 or IFM-RS232 or IFM-MESH modules

IFM-RS232 – 4x RS232 Ports

• Interface:
  • 4x RS232 ports, RX/TX only
  • Programmable baud rate up to 250kbps
  • Galvanically isolated from main unit
• Product Name: IOT-DIN-IMX8PLUS IFM-RS232 I/O module
• Connectors: 2x 10-pin socket with push-in spring contacts
• Stacking Restrictions: Up to 3x IFM-RS485 or IFM-RS232 or IFM-MESH modules

IFM-CAN-FD – 2x CAN-FD Ports + Digital I/O

• Interface:
  • 2x CAN-FD, galvanically isolated
  • 4x digital outputs + 4x digital inputs, 24V compliant with EN 61131-2
  • Galvanically isolated from main unit
• Product Name: IOT-DIN-IMX8PLUS IFM-CAN-FD I/O module
• Connectors: 2x 10-pin socket with push-in spring contacts
• Stacking Restrictions: Up to 1x IFM-CAN-FD module can be installed in stack

IFM-ADC8 – 8x Analog Inputs

• Interface: 8x analog input channels, configurable for 4...20mA or 0...10V
• Product Name: IOT-DIN-IMX8PLUS IFM-ADC8 I/O module
• Connectors: 2x 10-pin socket with push-in spring contacts
• Stacking Restrictions: Up to 1x IFM-ADC8 module can be installed in stack

IFM-WB – WiFi + Bluetooth

• Interface: 802.11ax WiFi and Bluetooth 5.3 BLE, implemented with Intel WiFi 6E AX210 module
• Product Name: IOT-DIN-IMX8PLUS IFM-WB wireless module
• Connectors: 2x RP-SMA connectors
• Stacking Restrictions:
  • Up to 1x IFM-WB module can be installed
  • Must be installed in position A (next to main gateway)

IFM-MESH – Wireless Mesh Interface

• Interface: Bluetooth mesh, Thread, Zigbee, Nordic Semiconductor nRF52840 / Silicon Labs MGM240 module
• Product Name: IOT-DIN-IMX8PLUS IFM-MESH wireless module
• Connectors: 1x RP-SMA connector
• Stacking Restrictions: Up to 3x IFM-RS485 or IFM-RS232 or IFM-MESH modules

IFM-NVME – NVMe SSD Storage

• Interface: M.2 NVMe 256GB SSD
• Product Name: IOT-DIN-IMX8PLUS IFM-NVME storage module
• Stacking Restrictions:
  • Up to 1x IFM-NVME module can be installed
  • Must be installed in position A (next to main gateway)

Mechanical Specifications

• Housing Type: DIN rail housing (for DIN rail version EN 50022)
• Housing Material: ABS/PC high endurance
• Dimensions (H x W x D): 110 x 20 x 95 mm
• Weight: 110 grams

Compliance

• Regulatory: FCC, CE, UKCA
• EMC: EN 55032/5, EN 61000-6-2, EN 61000-6-3
• Safety: EN/UL/IEC 62368-1

Reliability and Environmental

• MTTF: > 200,000 hours
• Warranty: 5 years
• Operation Temperature: -30° to 70° C
• Storage Temperature: -40° to 85° C
• Relative Humidity: 10% to 90% (non-condensing)

‍